Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon

09:03PM EDT – The final presentation of Hot Chips 31 is from Microsoft, who will be lifting the lid of the silicon behind its HoloLens 2.0 product.

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 1

09:17PM EDT – Here we go

09:17PM EDT – HPU 2.0

09:18PM EDT – Holographic processor

09:18PM EDT – Custom silicon, obviously

09:19PM EDT – This speaker has been trained. There are purposeful pauses when she lists stuff

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 2

09:20PM EDT – Application processor runs the app, and the HPU modifies the rendered image and sends to the display

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 3

09:20PM EDT – HPU works on specific workloads

09:21PM EDT – Takes the visual cues and allows the HPU to track where the hands are at all times

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 4

09:21PM EDT – 79mm2 on TSMC 16FF+

09:21PM EDT – 123M gates, 2B transistors

09:22PM EDT – 2016 Tapeout

09:22PM EDT – 125 Mb of SRAM

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 5

09:22PM EDT – First prototype

09:22PM EDT – First prototype headset*

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 6

09:23PM EDT – HPU 2 is dedicated to only Microsoft workloads

09:23PM EDT – Targets a single Microsoft RTOS

09:23PM EDT – No MMUs, simple interrupts

09:23PM EDT – Frees up the hardware

09:23PM EDT – Works with the software team to configure caches and memory

09:24PM EDT – Balance between dedicated HW compute and flexibility / programmability

09:24PM EDT – SIMD Fixed Point at top

09:24PM EDT – Does 2D processing

09:24PM EDT – FVP, Floating Vector Processor on bottom, does 3D

09:24PM EDT – 2 Tensiilica processors per node

09:24PM EDT – Trade off area for latency – low latency was key

09:24PM EDT – DMA channel per core

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 7

09:25PM EDT – New depth based algorithms

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 8

09:25PM EDT – 13 statically assigned compute cores

09:25PM EDT – >1 TOP of programmable compute

09:25PM EDT – 100s of customized instructions

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 9

09:26PM EDT – Algorithm profiling to turn 10s of ops into a single instruction

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 10

09:27PM EDT – Example, boxavg_2x16x8 is a single cycle instruction

09:27PM EDT – instruction is applied to every pixel, saving 10k+ cycles per frame

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 11

09:27PM EDT – Hardened compute on ToF sensor

09:27PM EDT – JBL filter

09:28PM EDT – Uses 3 sensors and applies filter

09:28PM EDT – But didn’t fit on the node. But adjusted a C model into RTL, for hardware. Reduces power to 1/3, and 1/30th latency

09:29PM EDT – Now thermals

09:30PM EDT – Power gating, clock gating, removing ULV cells

09:31PM EDT – Most digital logic at 250 MHz, compute at 500 MHz

09:31PM EDT – Reduced voltage, Vmin

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 12

09:31PM EDT – DVFS per chip

09:32PM EDT – Could take the guard bands off

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 13

09:32PM EDT – Can reduce the power by 20%

09:32PM EDT – at Vmin

09:32PM EDT – Now system integration

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 14

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 15

09:33PM EDT – HPU in front, App processor in back

09:33PM EDT – PCIe 2.0 x1 at 100 MB/s comms between front and back

09:34PM EDT – Rendered images sent back via MIPI to HPU

09:34PM EDT – MIPI QoS rates

09:35PM EDT – 6.8 GB/s needed to sync into two lanes of LPDDR4

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 16

09:35PM EDT – Custom DRAM scheduler on HPU 2.0

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 17

09:36PM EDT – Hologram stability

09:37PM EDT – Multiple pose updates per frame

09:37PM EDT – Hardened block on HPU decouples the render resolution to display resolution

09:37PM EDT – Gives more thermal headroom to GPU

09:38PM EDT – HPU Timestamps the sensor data as it comes in

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 18

09:38PM EDT – Hardened neural network

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 19

09:39PM EDT – Q&A

09:40PM EDT – Q: Comment on depth camera? A: Custom ToF, there’s a lot of literature out.

09:40PM EDT – Q: Scheduler? A: Statically assigned algorithms to the compute units

09:41PM EDT – Q: Transfer data between different VFPs? A: Small amount of bandwidth between VFPs, but mostly between memory.

09:43PM EDT – That’s a wrap! Thank you for staying with us through all the Hot Chips coverage!

Hot Chips 31 Live Blogs: Microsoft Hololens 2.0 Silicon 20
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