SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM

SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by Invensas. The latter was designed to enable building up to 16-Hi chip assemblies, including next-generation memory, and highly-integrated SoCs that feature numerous homogeneous layers.

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM 1

Invensas’ DBI Ultra is a proprietary die-to-wafer hybrid bonding interconnect technology that supports from 100,000 to 1,000,000 interconnects per mm2, using interconnect pitches as small as 1 µm. According to the company, the much greater number of interconnects can offer dramatically increased bandwidth vs. conventional copper pillar interconnect technology, which only goes as high as 625 interconnects per mm2. The small interconnects also offer a shorter z-height, making it possible to build a stacked chip with 16 layers in the same space as conventional 8-Hi chips, allowing for greater memory densities.

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM 2

Just like other next-generation interconnect technologies, DBI Ultra supports both 2.5D and 3D integration. Furthermore, it allows integration of semiconductor devices of different sizes and produced using different process technologies. Such flexibility will be particularly useful not only for next-generation high-capacity high-bandwidth memory solutions (including 3DS, HBM, and beyond), but for various highly-integrated CPUs, GPUs, ASICs, FPGAs, and SoCs.

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM 3

DBI Ultra uses a chemical bond that allows for interconnect layers that add no stand-off height, and require no copper pillars or underfill. While the process flow used for DBI Ultra is different when compared to conventional stacking processes, it continues to involve known good dies and does not require high temperatures, which results in relatively high yields.

All of this does come at a cost, however, and that’s something that Invensas keeps to itself. The firm does not disclose how much DBI Ultra costs to use, or how that compares to the technologies used today.

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM 4

SK Hynix does not disclose how it plans to use the DBI Ultra technology, though it is reasonable to expect the DRAM producer to use the new capability for next-generation memory products.

Craig Mitchell, president of Invensas, said the following:

“As the industry increasingly looks beyond conventional node scaling and turns toward hybrid bonding, Invensas stands as a pioneering leader that continues to deliver improved performance, power, and functionality, while also reducing the cost of semiconductors. We are proud to partner with SK hynix to further develop and commercialize our DBI Ultra technology and look forward to a wide range of memory solutions that leverage the benefits of this revolutionary technology platform.”

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM 5

Related Reading:

Source: Xperi

About the author

E-Crypto News was developed to assist all cryptocurrency investors in developing profitable cryptocurrency portfolios through the provision of timely and much-needed information. Investments in cryptocurrency require a level of detail, sensitivity, and accuracy that isn’t required in any other market and as such, we’ve developed our databases to help fill in information gaps.

Related Posts

E-Crypto News Executive Interviews

Automated trading with HaasBot Crypto Trading Bots

Crypto Scams

Millions in Cryptocurrency Stolen by Scammers in the Last Month According to Tenable Research
November 24, 2021
Behind The Scenes: How this Crypto Community Responded to + $50m Hack
October 18, 2021
Crypto Scams
Crypto Scams Still Persistent In 2021, SEC Warns About Red Flags To Watch
September 9, 2021
Poly Network
Here’s How Hackers Stole Over $600 million in the Poly Network Attack
August 12, 2021
The World’s Most Infamous Crypto Hacks and Scams
July 31, 2021

Blockchain/Cryptocurrency Questions and Answers

How Does Bitcoin Casino Work + 2021 Beginner’s Guide
November 8, 2021
How to Buy and Sell Cryptocurrency
November 8, 2021
What Are Bitcoin Futures And How Will They Work In 2022?
November 4, 2021
The Unconventional Guide to Ethereum
October 28, 2021
ICo Presale
The Science Behind ICO Presales…
October 14, 2021

CryptoCurrencyUSDChange 1hChange 24hChange 7d
Bitcoin38,570 1.01 % 10.78 % 9.48 %
Ethereum2,799.3 2.01 % 13.74 % 14.05 %
Tether0.9949 1.49 % 0.43 % 0.46 %
Binance Coin421.45 0.68 % 10.23 % 11.57 %
USD Coin0.9973 0.63 % 0.30 % 0.29 %
Solana125.40 1.62 % 11.97 % 14.64 %
Cardano1.210 1.11 % 13.96 % 2.51 %
XRP0.6792 0.97 % 10.43 % 11.97 %
Terra72.31 2.25 % 13.93 % 7.61 %
Polkadot21.86 1.37 % 13.74 % 15.39 %

Bitcoin (BTC) $ 38,863.00
Ethereum (ETH) $ 2,835.28
Tether (USDT) $ 1.00
Binance Coin (BNB) $ 423.72
USD Coin (USDC) $ 1.00
Cardano (ADA) $ 1.21
Solana (SOL) $ 123.39
XRP (XRP) $ 0.684734
Terra (LUNA) $ 73.27
Polkadot (DOT) $ 22.02